Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
Morning Overview on MSN
MIT’s heat-powered silicon chips hit 99% accuracy in math tests
Engineers at MIT have turned one of computing’s biggest headaches, waste heat, into the main act. By sculpting “dust-sized” silicon structures that steer heat as precisely as electrical current, they ...
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