Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ...

To support margins, MK Electron is leveraging a closed-loop recycling system that recovers high-purity metals such as gold, silver, tin and palladium for reuse in production. The approach is aimed at ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Together with a broad portfolio of K&S solutions, ASTERION™-TW will debut at the SEMICON China Trade Show – Hall N3, Booth #3431 – in Shanghai, from March 25, 2026 through March 27, 2026. Please ...

Introducing New Solutions to Address Emerging Assembly Challenges. SINGAPORE March 24, 2026 /PRNewswire=YONHAP/ -- Kulicke and Soffa Industries, Inc. ("K&S", "Company") today anno ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

Irvine, CA. TopLine, a designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it easy for universities, research facilities, laboratories, and ...

Semiconductor devices are now universal and have a critical role in modern-day society. Semiconductors influence how we provide entertainment, interact and communicate with the world, and enable many ...