This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...

With nearly $330,000 in funding from NSF, mechanical engineering Assistant Professor Panthea Sepehrband and a group of undergraduate, master's, and Ph.D. students have teamed up with K&S, a leading ...

Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...

I was recently asked which RLC and G signal factors determine if an IC should be packaged using wire-bond or flip-chip bonded technologies. I thought for a moment and answered; with countless ...

There’s much news from the Jezero Crater on Mars this week, and all of it was good. Not only did the Ingenuity helicopter make history by making the first powered, controlled flight of an aircraft on ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

A new study on the global wire bonding market is published by the author. It presents detailed information on key market dynamics, including drivers, trends, and challenges for the global wire bonding ...

Irvine, CA. TopLine, a designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it easy for universities, research facilities, laboratories, and ...

Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

ESEC die bonders at IBM in Burlington, Vt. Human inspectors armed with microscopes used to check the die bonds coming out of IBM's Burlington, Vt., facility. Trouble was, it was practical to ...