India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Lyten, Inc., an advanced materials and applications manufacturer, and inventor of its proprietary Lyten 3D Graphene™ platform, today announced its first 3D Graphene ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor technology and reducing import dependence.

In Bhubaneswar, India's inaugural 3D semiconductor packaging facility has been launched, promising to produce 70,000 glass panels annually. The Rs 1,943.53 crore investment aims to bolster sectors ...

India's first advanced 3D chip packaging unit, a significant step in advanced chip technology, is being closely monitored by ...

In recent years, 3D plant phenotyping has emerged as a promising field for understanding crop structure and productivity. However, accurately estimating leaf traits remains challenging because ...