The EE Times Magazine explores how ambient energy harvesting, sensing, AI, and connectivity enable safer, smarter buildings.

Qualcomm’s Modular buyout targets cross-chip portability across Nvidia, AMD, and its own AI hardware to break the software ...

TLS360™ is Rochester Electronics’ lifecycle assurance program, extending select mission-critical semiconductors beyond EOL ...

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat ...

OpenAI revealed first benchmarks for its Jalapeño ASIC, showing up to 1.9× perf/W gains over existing hardware for LLM ...

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling ...

SUSE targets sovereign AI via architectural choice, enabling enterprises to pivot between Nvidia and AMD silicon without ...

NVMe 2.4 updates 11 base specs, adding post-quantum cryptography, advanced power monitoring, and subsystem migration for AI ...

MIT uses laser pulses and ultrafast X-rays to map microscopic heat flow in multilayer semiconductors, exposing hidden defect ...

Explore how embedding decoupling capacitors within advanced packaging cuts parasitic inductance and stops transient voltage droop in AI chips.

Prepare for the EU Cyber Resilience Act's September 2026 reporting deadline; follow these seven steps to ensure compliance ...

IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and ...