Semiconductor Packaging News
MRSI (Mycronic), a US-based industry leader in high-precision chip and die assembly solutions, has encountered challenges due to the US ban on advanced semiconductor production in China. Our expertise is in providing state-of-the-art assembly solutions to industries like photonics, aerospace, and defense, among others. The ban ... MRSI, …
Semiconductor Packaging News
Global IC Fabs And Facilities Report: 2024 The chip industry ramped up investments in 2024, driven by government CHIPS Act funding and private capital. Major projects included new fabs, SiC, GaN, and advanced packaging facilities. Amkor and TSMC collaborated to enhance supply chain resilience, prioritizing national security. Semiconductor Engineering
Semiconductor Packaging News
MRSI (Mycronic), a US-based industry leader in high-precision chip and die assembly solutions, has encountered challenges due to the US ban on advanced semiconductor production in China. Our expertise is in providing state-of-the-art assembly solutions to industries like photonics, aerospace, and defense, among others. The ban ... MRSI, Mycronic
Semiconductor Packaging News
The U.S. Will Start Manufacturing Advanced Chips TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains while overcoming cultural, technical & workforce challenges under the CHIPS Act's $6.6 billion funding. IEEE Spectrum
Semiconductor Packaging News Index
Global IC Fabs And Facilities Report: 2024 The chip industry ramped up investments in 2024, driven by government CHIPS Act funding and private capital. Major projects included ... Semiconductor Engineering
Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT providers, IDMs, and new players, traditional industry roles face significant disruption. Digitimes
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies Summary The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness in microelectronics, addressing key R&D challenges ...
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech ...
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...
3D Packaging in Semiconductors Increased Trend for of Electric …
3D Packaging in Semiconductors Increased Trend for of Electric Devices Drives Demand Summary The global 3D semiconductor packaging market, valued at $11 billion in 2023, is projected to reach $57.19 billion by 2034, growing at a 16.17% CAGR. Asia Pacific leads the market, while North America sees rising demand in high-performance computing and automotive sectors. Times Tech Read the Full ...